Service Line: 03 Packaging
The MicroAutomation Wafer Dicing Saw Model 1100 is a programmable, Microprocessor-controlled, automatic saw for cutting semiconductor wafers and other hard material. The saw uses a split field video system for aligning the wafers before cutting, for program and data display, and for monitoring. It cuts maximum 150mm substrates up to 500mils thickness and has a spindle speed from 15000-40000 rpm. A vacuum holds the wafer on a chuck that can move left and right, up and down, and rotate.
Grigg Hall, Third Floor Room: 369 Bay Number: N/A