Flip Chip Bonder

Used for the most sophisticated die attach tasks, such as bonding of FlipChips, Micro Electro Mechanical Systems (MEMS), Micro Opto Electro Mechanical Systems (MOEMS), and sensors, on substrate sizes up to 50x50 mm2. The placement accuracy is ± 1.0 µm.
The Lambda is equipped with LEICA microscope, camera-monitor magnification and side camera observation systems, PC-controlled heating plate (up to 400C) and heated pick-up tolls. Bonding force is manually adjusted in the range of (0.1-500)N . Pick-up tools are now available for the following die sizes (LxWxThick):

• (3.0x1.0x0.15 ) mm2 ;
• (1.0x0.6x0.15 ) mm2 ;
• (1.0x1.0x0.5 ) mm2 ;

Manufacturer: Fine Tech

Contact:
Oleg Smolski
704-687-8288
osmolski@uncc.edu