Digital Wedge Bonding System

Service Line: 03 Packaging
Digital Wedge Bonding System
Digital Wedge Bonding System
For process development, production or research, the 4523AD Digital Wedge Bonding System provides the high yields and excellent repeatability needed for gold contact applications, including:

• Optoelectronic Modules
• Hybrid/MCMs
• Microwave Products
• Discrete Devices/Lasers
• Chip-on-Board

The tool is now set up for bonding 1 mil x 10 mil (25 μm x 250 μm) gold ribbon excellent for high power and high speed applications. The 4523AD Bonder also has the following features:

• Nikon microscope and spotlight targeting;
• Deep access capability;
• Flat substrate holder with built-in temperature controller;
• Motorized Y axis and programmable auto-stepback function for precise wire length and loop formation;
• Digital readout of all parameters etc.

Manufacturer: K&S
Model: 4523AD

Contact:
Oleg Smolski
704-687-8288
osmolski@uncc.edu

Tool Location:

Grigg Hall, Second Floor            Room: 207            Bay Number: N/A