Dicing Saw MicroAutomation

Service Line: 03 Packaging
Dicing Saw
Dicing Saw

The MicroAutomation Wafer Dicing Saw Model 1100 is a programmable, Microprocessor-controlled, automatic saw for cutting semiconductor wafers and other hard material. The saw uses a split field video system for aligning the wafers before cutting, for program and data display, and for monitoring. It cuts maximum 150mm substrates up to 500mils thickness and has a spindle speed from 15000-40000 rpm. A vacuum holds the wafer on a chuck that can move left and right, up and down, and rotate.

Manufacturer: MicroAutomation
Model: 1100

Contact:
Robert Hudgins
704-687-8125
rhudgins@uncc.edu

Tool Location:

Grigg Hall, Third Floor            Room: 369            Bay Number: N/A