Dicing Saw MicroAutomation
| Service Line: 03 Packaging | ||
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The MicroAutomation Wafer Dicing Saw Model 1100 is a programmable, Microprocessor-controlled, automatic saw for cutting semiconductor wafers and other hard material. The saw uses a split field video system for aligning the wafers before cutting, for program and data display, and for monitoring. It cuts maximum 150mm substrates up to 500mils thickness and has a spindle speed from 15000-40000 rpm. A vacuum holds the wafer on a chuck that can move left and right, up and down, and rotate.
Manufacturer: MicroAutomation Contact: |
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Dicing Saw| Tool Location: | ||
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| Floor: 3rd | Room: 369 | Bay: n/a |
