PVD 75 Thin Film Evaporation System

Service Line: 02 Material Deposition and Etching
Lesker
PVD 75 Thin Film Evaporation System
 
The Kurt J. Lesker PVD 75 thin film deposition system is equipped for electron-beam and thermal evaporation. We typically use the evaporator to deposit metals and semiconductor materials.  E-beam is the preferred evaporation technique for the high melting point materials.  Evaporation provides directionality in depositions  which is beneficial when doing liftoff metallization (as opposed to conformal coating with sputtering deposition).  Crystal oscillators are used to monitor deposition rates and thickness.  The chamber has the capacity to process three 100 mm wafers or a single 150, 200, or 300 mm wafer. 

The KJL CWare software, running under Windows, provides the operator an interface to do deposition runs in manual or automatic mode and users can have different privileges to allow access to these modes.  There are also data logging, alarms, interlocks, and password protection for individual users.

Manufacturer: Kurt J. Lesker

Contact:
Lou Deguzman
704-687-8111
pcdeguzm@uncc.edu

Tool Location:

Grigg Hall, Third Floor            Room: CleanRoom            Bay Number: 4