AJA Sputtering Tool
| Service Line: 02 Material Deposition and Etching | ||
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Sputtering Tool |
The AJA International ATC 1800-F sputter deposition system can accommodate wafers up to 150 mm in diameter. The system has 3 targets for single layer, sequential, or co-sputtered processes. The platen or substrate holder can be rotated during deposition for enhanced thickness uniformity. The substrate holder can also be heated to 500 degrees C during deposition to modify film properties. Sputtering is a physical process whereby atoms in a solid target material are ejected into the gas phase due to bombardment of the material by energetic ions. Sputtering is largely driven by a momentum exchange between the ions and atoms in the material, due to collisions. The ions for the sputtering process are supplied by a plasma that is induced in the sputtering equipment.
Manufacturer: AJA International Robert Hudgins 704-687-8125 rhudgins@uncc.edu |
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| Tool Location: | ||
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| Floor: 3rd | Room: CleanRoom | Bay: 4 |
