The Kurt J. Lesker PVD 75 thin film deposition system has the capacity to process three 100 mm wafers or a single 150, 200, or 300 mm wafer.  The PVD 75 is capable of thermal and electron-beam evaporation. 

For thermal evaporation, the crucible that holds the source material is heated by a filament that winds around it.  In the electron-beam method, the current that heats the crucible is boiled off a filament and is attracted to the crucible by a high voltage. Electron-beam is the preferred evaporation technique for the highest melting point elements.  Evaporative deposition proceeds in a line-of-sight fashion.  This is an important advantage and can be used to coat just one side of a substrate or even the single side of an etched feature.  Liftoff metallization also benefits from the directionality of this technique.