The LSD-100 employs a "break wheel" that rolls over the length of a scribe line. Breaking is achieved by applying tensile strain lateral to the scribe line. In this case the wheel bends the wafer over a curved surface ("Roller Breaking").

Features:

• Roller-Style Breaker
• Motorized Rotation Control
• 4" (100mm) Wafer Capability
• Color Camera
• Machine Control Software
• Auto Channel Recognition Software
• Windows® XP

Applications:

• Cleaving Laser Diodes
• Dicing Laser Bars
• Limited-Contact Dicing for:
  • Vicsels
  • GaAs FETs
  • MEMs
• Limited-Production Dicing